David C. Guiling 1627 S. Newland St. Lakewood, CO 80232 Email: davidguiling@gmail.com (972) 896-7965 (c) SUMMARY OF QUALIFICATIONS Science degreed technician with 20 years experience in semiconductor industry including research and development of new processes, optimization and maintenance of existing processes, troubleshooting hardware and process issues, and preventive maintenance of process, metrology and test equipment. Focus in thin film dielectric depositions, spin-on dielectrics, and anti-reflective coatings. Additional experience in measurement and analysis of various film properties. EDUCATION Southern Technical College, Little Rock AR A.A.S. in Electronic Technology, 1991 EXPERIENCE Process Engineer Technician, Sept.12-Nov.12 Ampulse Corporation, Golden CO •Developed proficiency in Photolithography, Reactive Ion Etching, KOH Silicon Texturing, Hydrogen Passivation, Wet Bench Chemistry, and Solar Device Testing within two months. Process Engineer Project Technician, 2000-2012 Texas Instruments, Dallas TX •Maintained ownership over five separate dielectric deposition processes in a high volume manufacturing facility. Responsible areas included plasma enhanced chemical vapor oxide and nitride depositions, anti-reflective silicon oxynitride depositions and spin-on dielectrics. •Released and qualified additional tools to increase capacity in the manufacturing production line. •Reduced costs by designing and implementing a near zero-cost interdictive chemical monitoring system. •Developed a technique which uses film stress metrology to monitor wafer bow throughout back end of line process steps. Method was used to qualify two technologies. •Module representative for ISO 16949 audits. •Key member of several cross-functional teams designed for continuous process improvement and defect reduction. Process Engineer Shift Technician, 1997-2000 Texas Instruments, Dallas TX •Worked with manufacturing and engineering teams to disposition non-conforming material. •Assisted with qualifying a new technology node using a metal stack deprocessing procedure and SEM imaging to quantify titanium aluminide grain formation in high vacuum systems. Manufacturing Operator, 1991-1997 Texas Instruments, Dallas TX •Operated and performed daily qualifications of plasma etch and thin film deposition tools. SKILLS MS Office, JMP, Spotfire Data Analysis, DOE, Gage R&R, SPC, FMEA, Lean Manufacturing, Root Cause Analysis, GMP, soldering, troubleshooting, hand tools, shop tools, electrical testing equipment. PATENTS “Method of Forming On-Chip Isolation Capacitors”, Texas Instruments, Nov. 2008 “Selective Plasma Etch of Top Electrodes for MIM Capacitors”, Texas Instruments, Nov. 2010